Ultra-Wideband Assembly System And Method

ABSTRACT

An ultra-wideband assembly is provided. The assembly includes a non-conductive tapered core having a conductive wire wound on an outer surface of the non-conductive tapered core, a low-frequency inductor coupled to the non-conductive tapered core via the distal end of the conductive wire and configured to allow mounting of the non-conductive tapered core at an angle with respect to the circuit board. The low frequency inductor is being disposed on a dielectric board configured to be coupled to the circuit board. The assembly includes an ultra-wideband capacitor coupled to the non-conductive tapered core via the proximate end of the conductive wire, the ultra-wideband capacitor being also coupled to the transmission line on the dielectric board.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention generally relates to electrical circuits.Specifically, the present invention relates to ultra-wideband assemblysystems and methods that provide a wide range of operational frequencieswith low insertion loss.

Background of the Invention

With the development of multi-media technology, there is an increasingdemand for constructing optical communication networks that are capableof providing transmissions at high speeds and accommodating largevolumes of information. There is also a demand to provide suchtransmissions at lowered costs and over long distances. Variousconventional systems that provide transmission high rates between 10Gb/s to over 40 Gb/s have been developed or are currently underdevelopment.

To accommodate such high speeds of transmission, electronic circuitshaving bias-tee (also referred to as “bias-T”) packages disposed ontransmitter-receivers have been developed. A conventional bias-teecircuit is in actuality a form of a multiplexer having three portsarranged in the shape of a “T” and having frequencies ranging from below30 KHz to at least 40 GHz pass horizontally through the T, and combinewith much lower frequencies including DC from the bottom path used tobias and/or modulate transistors, diodes, and passive circuits. Thecircuit is a simple composition of one capacitor and one coil with someattention paid to details.

In the conventional systems, the construction of a horizontal bar of theT is based on one or more of the many forms of transmission line havinglow-loss, non-conducting material, including gas, act as a dielectric.At one point, a small slice is cut out from the transmission lineconductor. Thus, a capacitor is formed and low frequencies are blocked.This kind of capacitor has an advantage that it is nearly invisible tohigher frequencies. To pass frequencies of typically several mega-Hertzand lower, the capacitance has to be increased. An ultra-widebandcapacitor, such as type 545L capacitor manufactured by AmericanTechnical Ceramics Corporation, and disclosed in the co-owned U.S. Pat.No. 7,248,458 to Mruz, the disclosure of which is incorporated herein byreference in its entirety, can be configured to accomplish this taskwithout adding significant perturbations to the insertion loss andreturn loss characteristics of the original straight-through line.

A small coil made of fine wire with an air core, a dielectric core,ferrite core, or a powdered iron core connects the inner conductor ofone of the sides of the capacitor with the port in the outer conductorleading down the T. Frequencies above of approximately 16 KHz hit thecoil at the small end. Because of increasing diameters of the coil asthe windings progress along the tapered length of the core, itsresonances are distributed across the entire frequency range of the Tcausing its inductive reactance characteristic to vary uniformly withfrequency. This results in a virtually resonance-free increase in theinductiveness of the coil, which, in-turn, causes a linear reduction inan RF leakage from the transmission line, as the frequency increases.Because of size constraints, this type of singe layer, tapered coilcannot be made with enough inductance to sufficiently prevent RF leakagethat occurs at very low frequencies. Thus, conventional systemsimplement a second coil, having considerably more inductance, to beplaced in-series with the first tapered coil starting at the large endof the first tapered coil.

Any resonances that may result from the larger coil and interactionsbetween these two tandem coils are dampened by two resistors placedacross the larger coil and in-series with both coils, respectively.

The conventional bias-tee packages are commonly used for biasing ofphotodiodes (vacuum and solid state), Microchannel plate detectors,transistors, and triodes. This stops high frequency energy from leakingonto a common power supply rail and stops noise from the power supplyfrom leaking onto the signal line.

The conventional systems employing the bias-tee packages suffer high anderratic insertion loss (i.e., a decrease in transmitted signal power)when operated over a wide range of operational frequencies. Thus, thereis a need for a system that can operate in a wide range of frequenciesand with low and well-behaved insertion loss.

SUMMARY OF THE INVENTION

The present invention relates to electrical circuits and morespecifically to ultra-wideband assembly systems and methods. In someembodiments, the present invention relates to an ultra-wideband assemblyincluding a non-conductive tapered core having an outer surface, anoptional layer of dielectric being disposed on at least a portion of theouter surface of the non-conductive tapered core, a distal end, and aproximate end. The distal end being larger than the proximate end. Theassembly includes a conductive wire having a proximate end and a distalend and being wound about at least a portion of the non-conductivetapered core. The proximate end of the conductive wire extends away fromthe proximate end of the non-conductive tapered core. The distal end ofthe conductive wire extends away from the distal end of thenon-conductive tapered core.

In some embodiments, the present invention relates to an ultra-widebandassembly in an electrical circuit having a circuit board with aconductive micro-strip line. The assembly includes a conductive taperedcore having an outer surface, a distal end, and a proximate end. Thedistal end being larger than proximate end. The assembly includes aconductive wire having a proximate end and a distal end and being woundabout at least a portion of the non-conductive tapered core. Theproximate end of the conductive wire extends away from the proximate endof the non-conductive tapered core and is being conductively coupled tothe micro-strip line of the circuit board. The distal end of theconductive wire extends away from the distal end of the non-conductivetapered core. The assembly further includes a supporting bracket havinga base portion and a core attachment portion. The base portion is beingconductively coupled to the circuit board. The core attachment portionis being coupled to the distal end of the non-conductive tapered coreand is further being conductively coupled to the distal end of theconductive wire.

In other embodiments, the present invention relates to an ultra-widebandassembly that includes a non-conductive tapered core having an outersurface, a distal end, and a proximate end. The distal end being largerthan proximate end. The assembly includes a conductive wire having aproximate end and a distal end and being wound about at least a portionof the non-conductive tapered core. The proximate end of the conductivewire extends away from the proximate end of the non-conductive taperedcore. The distal end of the conductive wire extends away from the distalend of the non-conductive tapered core. The assembly further includes adielectric layer disposed on top of at least a portion of the conductivewire being wound on the non-conductive tapered core, the dielectriclayer being disposed substantially near the proximate end of theconductive tapered core. The assembly also includes a metal pad coupledto the dielectric layer at the proximate end of the non-conductivetapered core.

In alternate embodiments, the present invention relates to a capacitorassembly for an electrical circuit having a transmission line. Theassembly includes a capacitor and a dielectric board. The capacitor isconfigured to be mounted to the dielectric board using a low-loss,high-temperature epoxy or some other appropriate low loss bonding agent.An air space is created between where the capacitor is mounted to thedielectric board. The capacitor is configured to be coupled to thetransmission line. The capacitor assembly is configured to minimizeperturbation of the electric field of the transmission line.

In some embodiments, the present invention relates to an ultra-widebandassembly in an electric circuit having a circuit board having atransmission line. The assembly includes a non-conductive tapered corehaving a conductive wire wound on an outer surface of the non-conductivetapered core, the conductive wire having a proximate end and a distalend, a low-frequency inductor coupled to the non-conductive tapered corevia the distal end of the conductive wire and configured to allowmounting of the non-conductive tapered core at an angle with respect tothe circuit board. The low frequency inductor is being disposed on adielectric board configured to be coupled to the circuit board. Theassembly also includes an ultra-wideband capacitor coupled to thenon-conductive tapered core via the proximate end of the conductivewire. The ultra-wideband capacitor being coupled to the dielectric boardand to the transmission line.

In some embodiments, the present invention relates to an inductorassembly that includes a multi-dimensional polygonal core having anouter surface, a distal end having a conductive metal pad, a proximateend having another conductive metal pad, a conductive wire having aproximate end and a distal end and being wound about at least a portionof the multi-dimensional polygonal core. The proximate end of theconductive wire is being coupled to another conductive metal pad of theproximate end. The distal end of the conductive wire is being coupled tothe conductive metal pad of the distal end.

Further features and advantages of the invention, as well as structureand operation of various embodiments of the invention, are disclosed indetail below with references to the accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

The present invention is described with reference to the accompanyingdrawings. In the drawings, like reference numbers indicate identical orfunctionally similar elements. Additionally, the left-most digit(s) of areference number identifies the drawing in which the reference numberfirst appears.

FIGS. 1a-i illustrate exemplary non-conductive tapered cores, accordingto some embodiments of the present invention.

FIG. 2a-b illustrates exemplary non-conductive tapered core assemblieshaving a metal bracket, according to some embodiments of the presentinvention.

FIG. 3a illustrates exemplary non-conductive tapered core having adielectric layer and a metal pad, according to some embodiments of thepresent invention.

FIGS. 3b-c illustrate another exemplary non-conductive tapered coreassemblies having a metal bracket, according to some embodiments of thepresent invention.

FIG. 4a-b illustrate exemplary capacitor(s) mounting, according to someembodiments of the present invention.

FIGS. 5a-f illustrate exemplary bias-tee assemblies, according to someembodiments of the present invention.

FIG. 5g illustrates another exemplary non-conductive tapered coreassembly having a metal bracket, according to some embodiments of thepresent invention.

FIG. 6 illustrates two plots depicting insertion loss and return lossusing bias-tee assemblies of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention generally relates to electrical circuits and morespecifically, the present invention relates to ultra-wideband assemblysystems and methods that improve operational frequencies of electricalcircuits.

In some embodiments, the present invention relates to a non-conductivetapered core assembly for mounting the core in an electrical circuit toimprove operational frequency range. FIGS. 1a-h illustrate an exemplarynon-conductive tapered core 100, according to some embodiments of thepresent invention. The core 100 has a shape of a pyramidelepiped (i.e.,a pyramid having a parallelogram base). In some embodiments, the core100 can be a square, a rectangular, a triangular, a polygonal, or anyother type pyramidal or other multi-dimensional structure. In someembodiments, the core 100 can be manufactured from powdered ironparticles.

FIG. 1a illustrates an exemplary powdered core 100, according to someembodiments of the present invention. As illustrated, the core 100 isconfigured in a form of a pyramidelepiped. As can be understood by oneskilled in the art, the form of the core 100 can be varied and the corecan have a tetrahedron pyramid shape (as shown in FIG. 1a ), atriangular pyramid shape (as shown in FIG. 1g ), or any othermulti-dimensional polygonal shape (as shown in FIG. 1h ). One of theadvantages of the pyramidelepiped core 100 shown in FIG. 1a , is that itis easier to form and wind than other shapes of the core. Further, thecore having a square cross-section provides a typical inductance of 12μH when #47 copper wire that is coated with single-build FORMAR®material or is fully wound on a 0.250 inch long taper with a 0.064 inchsquare distal end and a sharp pointed proximate end. As can beunderstood by one skilled in the art, other inductances along withdifferent types of wiring and sizing can be used. The above example isprovided for exemplary non-limiting purpose. The triangular and flatshaped cores, as shown in FIGS. 1g and 1h , may be physically suited inspecific applications, for example, accommodation of drop-on assemblies.The cores shown in FIGS. 1a-f are configured to include a tapering angleα, which can be defined as twice the angle formed by one of the facetsof the pyramidelepiped triangular cores with a plane that intersects thevertex of pyramidelepiped and is perpendicular to the base of thepyramidelepiped (as shown in FIG. 1i , illustrating a two-dimension viewof the tapered core 100). In some embodiments, the tapering angle α canbe in a range from less than 10 degrees to greater than 25 degrees. Inalternate embodiments, the tapering angle α can be in a range of 17-19degrees. In yet other embodiments, the tapering angle α can be 18degrees. In some embodiments, the tapering angle can be uniformthroughout the pyramidelipiped. In alternate embodiments, the taperingangle can vary from facet to facet of the pyramidelipiped. Also, thetapering angle of the core can vary according to the angle of mountingof the core assembly with respect to the circuit board (as illustratedin FIGS. 5a-c ). Depending on the applications, the tapering angle canbe a function of the angle of mounting of the core assembly on thecircuit. In some embodiments, the tapering angle can be a function ofthe angle of mounting of the core assembly on the circuit (and viceversa).

The core 100 has an outer surface 102, a distal end 104, and a proximateend 106. The distal end 104 is configured to be larger than theproximate end 106. The proximate end 106 is configured to be mountedadjacent to a transmission line on a circuit board, as will be discussedbelow.

A surface area of vertex of the pyramidelepiped shown in FIG. 1a can beconfigured to be a sharp point having a surface area of substantiallyzero. This allows forming a sharp point with the wire that is beingwound up to the vertex of the pyramidelepiped. In some alternateembodiments, the surface area of the vertex point can be configured tobe in the range between 0 to approximately 0.000025 square inches. Asurface area of each of the side facets of the pyramidelepiped shown inFIG. 1a is configured to be on the order of between 0.007951 squareinches for the blunt tip and 0.00800 square inches for the sharp tip inthis specific example. The surface area of the distal end (i.e., theparallelogram) is configured to be on the order of approximately 0.0041square inches. As can be understood by one skilled in the art, the abovevalues are provided for exemplary, non-limiting purposes, and othersurface areas are possible.

FIGS. 1b and 1c illustrate exemplary embodiments of the powdered core114 having a dielectric 111 disposed partially on the outer surface ofthe core, according to some embodiments. FIG. 1b illustrates that thedielectric 111 is disposed adjacent the proximate end of the powderedcore 114. The dielectric material 111 is configured to lower the coil'sinsertion loss at higher frequencies (i.e., frequencies typically above300 MHz). Additionally, the core material is separated from the RF endof the coil, which causes the lowering of resulting insertion loss whenplaced near a transmission line. In some embodiments, the dielectricmaterial 111 can be configured to assist in formation of the soft ironinto the shape of the powdered core 114, and thus, allows for formationof a sharp vertex of the pyramidelipiped. Additionally, the dielectricmaterial 111 can also be configured to serve as a protective measure,thereby preventing breakage of the powdered iron core during windingoperations. In some embodiments, the dielectric material is Rogers TMM6material, available from Rogers Corporation, Rogers, Conn., USA. Otherdielectric materials that can be used to replace portions of thepowdered iron core include dielectric materials having a dielectricconstant (which is defined as a measure of the extent, under givenconditions, to which the material concentrates electrostatic lines offlux) of eight or below.

FIG. 1b illustrates that the dielectric 111 is disposed throughout theproximate region of the powdered core 114. In some embodiments, thedielectric 111 can be disposed on the core 114 in a tapering fashion andconfigured to replace a portion of the core 114, so that the core 114appears smooth and without any protrusions, as illustrated in FIG. 1c ,which shows four orthogonal views of the same core. Such taperingdisposition of dielectric also allows for a gradual change in the lengthof the turns of the wiring. Such gradual change in length of the turnsis configured to allow better distribution of resonances of the coilwinding. This can be advantageous for some application as compared tothe core assembly shown in FIG. 1b , where dielectric is applied only tothe tip of the core assembly and coil windings experience a sharp changealong its winding length, which may cause small resonance effect thatwill generate insubstantial variations in the swept insertion lossresponse. These variations are not noticeable where the tapereddielectric, shown in FIG. 1c , is employed. However, the inductance ofthe coil assemblies with tapered dielectric, shown in FIG. 1c , is lessthan the coil assemblies with a dielectric being disposed at the tip ofthe core, as shown in FIG. 1b . As can be understood by one skilled inthe art, the dielectric material can be disposed on the core accordingto any desired configuration of the system using the coil assemblies, asshown in FIGS. 1b -c.

FIGS. 1d-1f illustrate exemplary embodiments of the powdered core 124having a conductive wire 126 wound (forming a winding 125) on the outersurface 128 of the core 124, according to some embodiments of thepresent invention. The conductive wire 126 includes a proximate end 132and a distal end 134. The proximate end 132 is configured to be disposedsubstantially adjacent the proximate end 138 of the core 124. The distalend 134 is configured to be disposed substantially adjacent the distalend 140 of the core 124. The proximate end 132 is configured to connectthe conductive wire 126 to a transmission line of the electrical circuit(not shown in FIG. 1d ). The proximate end 132 of the wire 126 isfurther configured to extend away from the proximate end 138 of the core124. The distal end 134 can be configured to be coupled to an inductor(not shown in FIG. 1d , but is shown in FIGS. 5a-f below). The distalend 134 of the wire 126 is configured to extend away from the distal end140 of the core 124.

The proximate end 132 of the conductive wire 126 is configured to extendin the range of 0 inches to approximately 0.010 inches (in someembodiments, the proximate end 132 can extend in the range of 0.001inches to less than 0.006 inches) away from the proximate end 138 of thecore 124. In some embodiments, the length of proximate end 132 of theconductive wire 126 extending from the proximate end 138 of the core 124is approximately 0.006 inches.

The conductive wire 126 is configured to have a diameter in the range ofabout 0.001 inches to about 0.013 inches. In some embodiments, the rangeof diameters of the wire can be from 0.005 inches to about 0.009 inches.In some embodiments, the diameter is equal to about 0.0007 inches. Insome applications and embodiments, the diameter of the wire can extendbeyond the 0.001 to 0.013 inches range. These applications relate toboth the required inductance valve and the current carrying capacity ofthe coil which interdependently relate to both wire diameter and wirelength (as length relates to the number of turns). Such applicationsinclude amplifier front-end and driver stage decoupling networks,varactor diode bias voltage RF isolation inductors, and PIN switch DCdriver networks. As can be understood by one skilled in the art, otherdiameters of the wire are possible. The wire 126 is configured to bewound around the entire conductive core 124. In some embodiments, thewire 126 is configured to be wound around a portion of the conductivecore 124. Such partial winding can be useful in applications such asthose shown in and discussed in connection with FIG. 5a . In theseembodiments, the distal end of the core assembly is sometimes machinedoff at an odd angle to make it compatible (mechanically or otherwise)with another coil assembly to which the first assembly is being coupled.

As illustrated in FIGS. 1d-1f , the wire 126 is wound around the core124 so that there is substantially no spacing between the turns of thewire 126, i.e., the wire 126 is being tightly wound around the core 124.In some applications and/or as desired, the wire 126 can be wound aroundthe core 124 with some predetermined spacing. This spacing can either beconstant along the length of the coil or it can vary along the length ofthe coil.

In some embodiments where the above tapered coils are used, theultra-wideband assembly formed by the core and the windings discussedabove, when connected in a circuit are configured to maintain signallevels (or minimize insertion loss, which is the decrease in transmittedsignal power resulting from the insertion of a device in a transmissionline or optical fiber) in a frequency range of below 70 MHz to at least40 GHz. In some embodiments where smaller tapered coils are employed,the lower frequency attenuation limits can be moved substantially higherthan the 70 MHz and remain extended to at least 40 GHz. In someembodiments, the present invention's assemblies are configured tomaintain signal levels (or minimize insertion loss) to below 1.0 decibel(“dB”) in a frequency range of at least 16 KHz to 40 GHz. Further, insome embodiments, the present invention's assemblies can be configuredto maintain signal levels in a range from below 100 KHz to over 100 GHzrange.

There are various ways to manufacture the tapered core 124. In someembodiments, the tapered core can be pressed into a mold by conventionalpress equipment that is configured to press iron cores into a desiredshape (or one shown in FIGS. 1a-h ). One of the issues involved withusing a mechanical press to manufacture tapered core is the fragility ofthe tapered core. Because of this characteristic, it is difficult toform a sharp point of the core (as shown in FIGS. 1a-1f ), i.e., ittypically breaks off.

In some embodiments, the material, i.e., iron powder, can be mixed withepoxy into a thick colloidal paste and then poured into a mold that hasbeen sprayed with a release agent. The release agent is a substance usedin molding and casting that aids in the separation of a mold from thematerial being molded and reduces imperfections in the molded surface.In this case, the examples of a release agent that can be used aretypical non-contaminating release polymers manufactured by Frekote andothers. Wax and silicon agents can also be employed. As can beunderstood by one skilled in the art, other types of release agents canbe used. One of the issues involved in this method of manufacturing thepowdered core is that the epoxy that is suspended along with the ironparticles makes the core somewhat ineffective as compared to the corewithout the epoxy. Thus, the resulting inductance of the core with theepoxy is only typically about 70% of what it could be without the epoxy.

Another way to manufacture the powdered core is to take a pressed rod(or any other configuration) and sanded it into the configuration shownin FIGS. 1a-f . Then, in some embodiments, the sanded core can be coatedwith a thin varnish to strengthen it. Subsequent to the coating step,wire can be wound around the core starting at the proximal (or pointedend). In some embodiments, the winding can start within three turns ofthe pointed end.

In some embodiments, the inductance value of the tapered coil assembliesillustrated in FIGS. 1a-h can range from 2 microhenries (“μH”) to over20 μH. In alternate embodiments, the inductance value can range from5-12 μH. Yet in other alternate embodiments, the inductance value of theassembly can be 10 μH.

As can be understood by one skilled in the art, the length of the coreand the distal end cross-section dimensions can vary based upon, forexample, the number of turns of the wire that are desired, as well asany other parameters of the assembly. In some embodiments, the area ofthe proximate tip does not vary.

FIG. 2a illustrates an exemplary ultra-wideband assembly 200 thatincludes the conductive tapered core 202 having a metal bracket 220configured to be coupled to the core 202 to the circuit board 254,according to some embodiments of the present invention. The core 202includes a conductive wire winding 204 configured to be wound around thecore 202 in a fashion similar to the winding around core 101 illustratedin FIGS. 1a-h . The conductive tapered core 202 includes an outersurface 206, a distal end 208, and a proximate end 210. The distal end208 is configured to have a larger surface area than the proximate end210. The proximate end 210 is configured to be disposed substantiallyadjacent a micro-strip transmission line 252 of the circuit board 254.The conductive wire 204 includes a proximate end 212 and a distal end214. The proximate end 212 is configured to be disposed substantiallyadjacent the proximate end 210 of the core 202. The distal end 214 isconfigured to be disposed substantially adjacent the distal end 208 ofthe core 202. The proximate end 212 of the wire 204 is configured to beconnected to the transmission line 252 of the circuit board 254. Thedistal end 214 of the wire 204 is configured to be coupled to asupporting bracket 220.

One end or a core attachment portion 224 of the bracket 220 isconfigured to be coupled to the distal end 208 of the core 202, asillustrated in FIG. 2a . Another end or a base portion 226 of thebracket 220 is configured to be coupled to the circuit board 254. Thebase portion 226 is also configured to be conductively coupled to thecircuit board 254.

The bracket 220 is configured to position the core 202 having thewinding 204 at a particular angle β with respect to the circuit board254. In some embodiments, the angle between the central axis of thetapered core 202 and the horizontal top surface of the micro-strip boardin a range of greater than 25 degrees to 90 degrees (i.e., substantiallyvertical mounting of the core 202). In some embodiments, range of anglesis in the range of 40 degrees to 70 degrees. In some embodiments, theangle β is 63 degrees to the micro-strip line, as illustrated in FIG. 2b.

FIGS. 3a-c illustrate an exemplary ultra-wideband assembly 300 thatincludes the conductive tapered core 302 having a metal bracket 320configured to couple the core 302 to the circuit board, according tosome embodiments of the present invention.

The core 302 includes a conductive wire winding 304 configured to bewound around the core 302 in a fashion similar to the winding aroundcore 101 illustrated in FIGS. 1a-h . The conductive tapered core 302includes an outer surface 306, a distal end 308, and a proximate end310. The distal end 308 is configured to have a larger surface area thanthe proximate end 310. The proximate end 310 is configured to bedisposed substantially adjacent a micro-strip transmission line of acircuit board (not shown in FIGS. 3a-c ). The conductive wire 304includes a proximate end 312 and a distal end 314. The proximate end 312is configured to be disposed substantially adjacent the proximate end310 of the core 302. The distal end 314 is configured to be disposedsubstantially adjacent the distal end 308 of the core 302. The proximateend 312 of the wire 304 is configured to be connected to thetransmission line of the circuit board.

In some embodiments, the ultra-wideband assembly 300 includes adielectric layer 334 that is configured to be disposed substantiallynear the proximate end 310 of the core 302. In some embodiments, thedielectric layer 334 is configured to be disposed on top of at least aportion of the conductive wire 304. The thickness of the dielectriclayer 334 can be in the range from 0.004 inches to about 0.015 inches.The thickness of the dielectric layer 334 can be on the order ofapproximately 0.010 inches. In some embodiments, the material of thedielectric layer can be Rogers RO4350, manufactured by RogersCorporation, Connecticut, USA, which is a hydrocarbon ceramic loadedglass. This material is characterized by its strength, mechanicalrigidity and stability over a wide range of temperatures. Other similarlow loss, low dielectric constant materials with a thicknesses of 0.010inches or less can be used if so desired.

In alternate embodiments, the thickness of the dielectric layer can varythroughout the dielectric layer 334. Further, in some embodiments, thedielectric layer can be disposed on one side of the tapered core, whileleaving the other side free of the dielectric layer. In some embodimentswhere the dielectric layer is disposed on the top side of the woundcore, the connection between the tip of the fine wire wound around thecore and the micro-strip line (or any other type of transmission line),allows the tip to be closer to the micro-strip line, thereby reducingresonant responses. In the embodiments where the dielectric is disposedon the bottom side of the core, i.e., closer to the transmission line(which makes the tip of the wire disposed further away from thetransmission line), the resonant responses may be enhanced.

In some embodiments, the dielectric layer includes a metal pad 338. Themetal pad 338 is configured to be disposed on at least a portion of thedielectric layer 334 and substantially adjacent to the proximate end ofthe core 304. The metal pad 338 can be configured to provide a robustcontact to the proximate end 312 of the wire 304. In some embodiments,the metal pad 338 has a thickness of approximately 0.0007 inches (i.e.,the thickness of a half-ounce copper cladding). The surface area ofmetal pad 338 can be configured to be on the order of approximately0.003 square inches (i.e., approximately 0.025 inches×0.012 inches). Insome embodiments, the metal pad is configured to be manufactured fromcopper that is initially electrolessly deposited on the dielectric.Electroless plating is an auto-catalytic reaction used to deposit acoating of metal on a substrate. Unlike electroplating, it is notnecessary to pass an electric current through the solution to form adeposit. Electroless plating has several advantages versuselectroplating. Free from flux-density and power supply issues, itprovides an even deposit regardless of the work piece geometry, and withthe proper pre-plate catalyst, can deposit on non-conductive surfaces.Subsequent to the electroless plating, the tip of the dielectricmaterial plated with copper is electroplated with either tin, acombination lead and tin, silver, gold, or any other suitable metal.

As illustrated in FIGS. 3a-c , the dielectric layer 334 along with themetal pad 338 are configured to protrude away from the proximate end 312of the conductive core 304. The metal pad is configured to contact thetransmission line of the circuit (not shown in FIGS. 3a-c ).

In some embodiments, the dielectric layer 334 is manufactured from apure ceramic, ceramic reinforced glass, or polytetrafluoroethene orpolytetrafluoroethylene (“PTFE”) based materials, PTFE materialsreinforced with glass fibers, hydrocarbon ceramic composites, variousrigid plastics, or any other suitable materials. The metal pad 338 ismanufactured from copper, nickel, silver, gold, palladium, or any othersuitable materials.

In some embodiments, the distal end 314 of the wire 304 is configured tobe coupled to a supporting bracket 320. One end or a core attachmentportion 324 of the bracket 320 is configured to be coupled to the distalend 308 of the core 302, as illustrated in FIGS. 3a-c . Another end or abase portion 326 of the bracket 320 is configured to be coupled to thecircuit board. The base portion 326 is also configured to beconductively coupled to the circuit board 354. The bracket 320 isconfigured to position the core 302 having the winding 304 at aparticular angle with respect to the circuit board (not shown in FIGS.3a-c ).

FIG. 4a illustrates an exemplary capacitance assembly system 400 formounting a capacitor to a dielectric board to minimize assembly'sperturbation of an electric field of a transmission line after mountingof the capacitor, according to some embodiments of the presentinvention. FIG. 4a illustrates a capacitor 402 mounted to a dielectricboard 404. The capacitor 402 can be an ultra-broadband or any othercapacitor. The capacitor 402 is configured to be mounted to thedielectric board 404 using a low loss, high temperature epoxy. In someembodiments, when the capacitor 402 is mounted to the dielectric board404, an air space 406 is created between the capacitor 402 and thedielectric 404. When dielectric material is brought into close proximitywith either a transmission line or an energy-carrying component, such asa capacitor, the dielectric material attracts energy into itself andchanges the electrical characteristics of the item that it is drawingenergy (i.e., electric field) from. This undesirable situation isminimized by removing as much of this dielectric as practical from thesensitive regions of these structures.

In some embodiments, the capacitor is configured to be directly attachedto a transmission line of the circuit (not shown in FIG. 4a ). In otherembodiments, the capacitor can include ribbon leads 445 (a, b), asillustrated in FIG. 4b , that can be used to connect the capacitor tothe transmission line of the circuit. The capacitor assembly 400 isconfigured to minimize perturbation of an electric field of thecircuit's transmission line subsequent to mounting of the capacitor 402.

FIGS. 5a-f illustrate an exemplary embodiment of an ultra-widebandassembly 500 that includes a surface mountable ultra-broadband bias-tee,according to some embodiments of the present invention. The assemblyincludes a tapered core 502, an inductor 560, an ultra-widebandcapacitor 562, a bypass capacitor 564, and resistors 582, 584.

The core 502 includes a conductive wire winding 504 configured to bewound around the core 502 in a fashion similar to the winding aroundcore 101 illustrated in FIGS. 1a-h . The conductive tapered core 502includes an outer surface 506, a distal end 508, and a proximate end510. The distal end 508 is configured to have a larger surface area thanthe proximate end 510. The proximate end 510 is configured to bedisposed substantially adjacent a micro-strip transmission line 552 ofthe circuit board 554. The conductive wire 504 includes a proximate end512 and a distal end 514. The proximate end 512 is configured to bedisposed substantially adjacent the proximate end 510 of the core 502.The distal end 514 is configured to be disposed substantially adjacentthe distal end 508 of the core 502. The proximate end 512 of the wire504 is configured to be connected to the transmission line 552 of thecircuit board 554.

The distal end 508 of the core 502 is configured to be coupled to a lowfrequency inductor 560. The low frequency inductor 560 is configured tobe mounted on dielectric substrate 570, which is in turn coupled to thecircuit board 554, as illustrated in FIGS. 5a-f . In some embodiments,the inductor 560 has a value of 220 μH and is capable of handling 300mA. As can be understood by one skilled in the art, the inductor 560 canhave a different inductance values and can be capable of handlingcurrents having different values. The above referenced numbers areprovided here for exemplary purposes only and are not intended to limitthe scope of the present invention.

The ultra-wideband assembly 500 further includes an ultra-widebandcapacitor 562 mounted to the dielectric substrate 570, as furtherillustrated in more detail in FIG. 5d . The capacitor 562 can beconfigured to be mounted to the dielectric substrate 570 in a similarfashion as the capacitor shown in FIGS. 4a-b . As such, the core 502 isconfigured to be coupled to the capacitor 562, which is in turn, can beconfigured to be coupled to the transmission line 552 of the circuitboard 554. The capacitor 562 is coupled to the core near its proximateend 510 using the proximate end 512 of the conductive wire 504. In someembodiments, the capacitor 562 can be coupled directly to thetransmission line 552. In alternate embodiments, the capacitor 562 caninclude conductive leads (shown in FIG. 4b ) that can be coupled thetransmission line 552.

The assembly 500 further includes a bypass capacitor 564 mounted on thedielectric substrate 570. The capacitor 564 can be configured to beconnected in parallel with the DC port of the bias T assembly to ground.In some embodiments, there can be more than one bypass capacitor 564being connected to the bias T assembly 500. The bypass capacitor(s) 564can be configured to short any RF energy signals leaking through theultra-wideband inductor 560 and the core assembly 502 to ground. This isaccomplished by having the bypass capacitor(s) 564 being connected tothe “cold side” of the ultra-wideband inductor 560 and to ground. Asillustrated in FIGS. 5a and 5f , the bypass capacitor(s) 564 is disposedin the rear of the assembly 500. As can be understood by one skilled inthe art, the location of the bypass capacitor(s) 564 is not limited tobeing disposed in the rear of the bias-T assembly 500. The capacitorscan be placed anywhere and then coupled to the assembly, as discussedabove. In some embodiments, the capacitance of the bypass capacitor(s)564 can range from 100 nano Farad (“nF”) to over 220 nF. In someembodiments, the capacitance of the bypass capacitor(s) can extendbeyond the above referenced range in various applications.

In some embodiments, the assembly 500 can further include a dampingresistor 584 and an isolating resistor 582, as illustrated in FIGS. 5a-b. The resistor 584 is connected in-parallel with the ultra-widebandinductor 560 and is primarily used to dampen the resonant responseswithin that inductor 560. The resistor 582 is an isolating resistor thatdampens any potential interactions between networks that may be coupledto the bias-T assembly 500 and their respective electrical DC feedlines. In some embodiments, the resistance of the damping resistor 584is configured to be in a range of 180 Ohms and higher. The resistance ofthe isolating resistor 582 is configured to be in a range ofapproximately 0 Ohms to approximately 100 Ohms.

The dielectric or base substrate 570 material can be manufactured fromany insulating, rigid, low loss dielectric, either a uniform compositeor reinforced woven structure having a loss tangent (which is a measureof loss-rate of power of an electrical mode, such as an oscillation, ina dissipative system) of 0.005 or less and a dielectric constant of 10or less would be acceptable. As can be understood by one skilled in theart, any other suitable materials can be used for the dielectricsubstrate 570.

In some embodiments, the ultra-wideband assembly 500 can be configuredto attenuate signals in a frequency range of 16 KHz to about 40 GHz. Inalternate embodiments, where smaller secondary coils are employed, thesignals are attenuated in a frequency range of 300 KHz to about 40 GHz.In some embodiments, the upper and lower limits of the above frequencyranges can be specifically tailored to particular applications and canbe configured to depend on the values of the inductor 560 and the coilassembly 502 as well as the ultra-wideband capacitor(s) 562. In someembodiments, the range of signal frequencies being attenuated can befrom below 10 KHz to well over 100 GHz.

In some embodiments, the assembly 500 further includes a protectivecover 575 configured to protect isolating and damping resistors 582 and584, respectively. The cover 575 can be manufactured from anyinsulating, rigid, material that is either a uniform composite orreinforced woven structure. The assembly 500 can be further coupled toan external DC supply line 590, as illustrated in more detail in FIGS.5a, 5c, and 5f . In some embodiments, Mylar tape or any other insulator599 is configured to insulate bottom contact of the bias tee assemblyfrom the micro-strip line ground contact. In some embodiments, the RFground contact of the assembly is made with three bypass caps 588. Asillustrated in FIG. 5b , the resistor 582 can be connected in serieswith a bias supply line 577.

FIG. 5g illustrates an alternate embodiment of the bias-T assembly 540.The assembly 540 includes a supporting metal bracket 542, a coilassembly 544, and a capacitor assembly 546. The assembly 540 isconnected to the micro-strip circuit line 547. The bracket 542 issimilar to the brackets 220 and 320 discussed in connection with FIGS.2a and 3a-c and can be configured to be coupled to the circuit board(not shown in FIG. 5c ). The coil assembly 544 is similar to the coilassemblies discussed in connection with FIGS. 1a-3c and 5a-b . Thecapacitor assembly 546 is also discussed in connection with FIG. 4a . Insome embodiments, the capacitor assembly 546 can be similar to thecapacitor assembly 440 shown in FIG. 4b . As illustrated in FIG. 4b ,the capacitor assembly 440 includes capacitor 442 that is configured tobe coupled to the transmission or micro-strip line (not shown in FIG. 4b) via conductive ribbon leads 445 a and 445 b, respectively. Anexemplary capacitor 442 can be an ultra-wideband capacitor, such as type545L manufactured by American Technical Ceramics Corporation, anddisclosed in a co-owned U.S. Pat. No. 7,248,458 to Mruz, the disclosureof which is incorporated herein by reference in its entirety. Asillustrated in FIG. 4b , a coating 443 is configured to protect acircumferential channel (not shown in FIG. 4b ) of the capacitor 442.The capacitance value of the capacitor assembly 440 can be similar tothe capacitance value stated above with regard to the assembly shown inFIG. 4a . Referring back to FIG. 5g , the capacitor 546 can includeribbon leads that connect the capacitor assembly to the transmissionline 547. Similarly to FIGS. 4a-b , the capacitance value of the entireassembly can be substantially equal to the capacitance value of theassemblies shown in FIGS. 4a-b . The assembly 540 further includes alow-loss dielectric element 549 (e.g., with a dielectric constant lessthan 10; as can be understood by one skilled in the art, materials withother dielectric constants can be used). In some embodiments, thethickness of the dielectric element 549 can be about 0.010 inches thick.The dielectric 549 is glued to the coil, and the capacitor is glued toits two legs 575 a and 575 b, as shown in FIG. 5g . The wire from thecoil 544 tip is then directly connected to one of the two capacitorterminals. This forms the bias tee of 540. Because, there is nosecondary coil, the low frequency end of this bias tee is about 2 MHz;the upper end is about 40 GHz. In some embodiments, when a secondarycoil is included, the assembly 540 can cover the frequency range frombelow 16 KHz to above 40 GHz.

FIG. 6 illustrates two typical plots depicting both the insertion lossand return loss characteristics of the bias tee assemblies illustratedin FIGS. 5a-f . As can be seen from the plots, no resonances were notedfrom 400 MHz to 40 GHz. Further, insertion loss and return loss remainedbelow 0.8 dB and 15 dB, respectively. The device remains virtuallyresonance free to its lower 3 dB roll-off frequency which is typicallybelow 100 KHz.

Example embodiments of the methods and components of the presentinvention have been described herein. As noted elsewhere, these exampleembodiments have been described for illustrative purposes only, and arenot limiting. Other embodiments are possible and are covered by theinvention. Such embodiments will be apparent to persons skilled in therelevant art(s) based on the teachings contained herein. Thus, thebreadth and scope of the present invention should not be limited by anyof the above-described exemplary embodiments, but should be defined onlyin accordance with the following claims and their equivalents.

1-17. (canceled)
 18. An ultra-wideband assembly, comprising: anon-conductive tapered core having an outer surface; a distal end; and aproximate end, said distal end being larger than proximate end; aconductive wire having a proximate end and a distal end and being woundabout at least a portion of said non-conductive tapered core; saidproximate end of said conductive wire extends away from said proximateend of said non-conductive tapered core; said distal end of saidconductive wire extends away from said distal end of said non-conductivetapered core; said conductive wire contacts at least a portion of saidouter surface of said non-conductive tapered core; a dielectric layerdisposed on top of at least a portion of said conductive wire beingwound on said non-conductive tapered core, said dielectric layer beingdisposed substantially near said proximate end of said non-conductivetapered core; a metal pad coupled to said dielectric layer at saidproximate end of said non-conductive tapered core.
 19. The assemblyaccording to claim 18, wherein said dielectric layer is configured toextend away from said outer surface of said non-conductive tapered core.20. The assembly according to claim 18, wherein said dielectric layerhas a thickness in range between 0.004 inches to about 0.015 inches. 21.The assembly according to claim 18, wherein said dielectric layer ismanufactured from low loss dielectric material having a low dielectricconstant.
 22. The assembly according to claim 21, wherein saiddielectric material includes at least one of the following: ahydrocarbon ceramic loaded glass, ceramic, ceramic reinforced glass orPTFE-based materials, PTFE materials reinforced with glass fibers,hydrocarbon ceramic composites, a rigid plastic, and any combinationthereof.
 23. The assembly according to claim 18, wherein said metal padhas a thickness of approximately 0.0007 inches.
 24. The assemblyaccording to claim 18, wherein said metal pad includes a copper layer,whereby the copper layer is configured to be initiallyelectroless-deposited on said dielectric layer and then electroplatedonto said dielectric layer and then said copper layer is configured tobe plated with a metal, the metal including at least one of thefollowing: tin, lead/tin combination, silver, gold, and any combinationthereof.
 25. The assembly according to claim 18, wherein the assembly isconfigured to be coupled to a circuit board in an electrical circuit.26. The assembly according to claim 25, wherein said metal pad isconfigured to contact said proximate end of said conductive wire togenerate a robust contact with a micro-strip line of the circuit board.27. The assembly according to claim 26, further comprising a supportingbracket having a base portion; and a core attachment portion; said baseportion is being conductively coupled to the circuit board; said coreattachment portion is being coupled to said distal end of saidnon-conductive tapered core and is further being conductively coupled tosaid distal end of said conductive wire; wherein said supporting bracketand said distal end of said conductive wire provide a robust contactwith said circuit board. 28.-61. (canceled)
 62. The assembly accordingto claim 18, wherein said metal pad is manufactured from at least one ofthe following materials: copper, nickel, silver, gold palladium, and anycombination thereof.
 63. The assembly according to claim 18, whereinsaid non-conductive tapered core has at least one of the followingshapes: a tetrahedron shape, a triangular pyramid shape, amulti-dimensional polygonal shape, and any combination thereof.
 64. Theassembly according to claim 18, wherein said non-conductive tapered coreis composed of powdered iron.
 65. The assembly according to claim 18,wherein a surface area of said distal end is approximately equal to0.0041 square inches.
 66. The assembly according to claim 18, wherein asurface area of said proximate end is in a range from 0 square inches to0.000025 square inches.
 67. The assembly according to claim 18, whereinsaid tapered non-conductive core has a tapering angle, wherein saidtapering angle is in a range of less than 10 degrees to greater than 25degrees.
 68. The assembly according to claim 18, wherein the assembly isconfigured to reduce insertion loss in a frequency range from below 10KHz to over 100 GHz.
 69. The assembly according to claim 18, whereinsaid proximate end of said conductive wire extends in a range fromapproximately 0 inches to approximately 0.010 inches away from saidproximate end of said non-conductive tapered core.
 70. The assemblyaccording to claim 18, wherein the assembly have a value in the rangefrom 2 microhenries (“μH”) to about 20 μH.